18 layer large size PCB Manufacturers

It is a good way to boost our products and solutions and repair. Our mission is always to establish artistic products and solutions to consumers having a excellent expertise for 18 layer large size PCB,EM888 High Speed PCB,EM526 High Speed PCB,Oversized size PCB,TUC High Speed PCB, Our items have exported to North America, Europe, Japan, Korea, Australia, New Zealand, Russia and other countries. On the lookout ahead to make up a good and long-lasting cooperation with you in coming potential!
18 layer large size PCB, we sincerely hope to establish a good and long-term business relationship with your esteemed company through this opportunity, based on equality, mutual benefit and win-win business from now to the future. "Your satisfaction is our happiness".

Hot Products

  • BCM5466SRA0KFB

    BCM5466SRA0KFB

    BCM5466SRA0KFB is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TDA201-001V03

    TDA201-001V03

    TDA201-001V03 is a high-definition military LCD launched by BOE. It is currently in short supply and the annual production capacity is insufficient. The production time is generally about half a year.
  • HI-3583APQI-15

    HI-3583APQI-15

    HI-3583APQI-15 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU4EV-2SFVC784I

    XCZU4EV-2SFVC784I

    ​XCZU4EV-2SFVC784I is a SoC FPGA chip produced by Xilinx, belonging to the Zynq UltraScale+series. This chip integrates four ARM Cortex-A53 MPCore processors, dual ARM Cortex-R5 processors, and ARM Mali-400 MP2 graphics processors, with rich peripheral interfaces and storage media support, such as DDR4 and LPDDR4 memory
  • XC7VX690T-2FFG1761C

    XC7VX690T-2FFG1761C

    XC7VX690T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • HI-8598PSMF

    HI-8598PSMF

    ​Galvanic Isolation: HI-8598PSMF is the world's first ARINC 429 line driver to use galvanic isolation technology, providing an isolation voltage of 800V to ensure isolation between the ARINC 429 data bus and sensitive digital circuits, which is particularly important for safety critical systems.

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