16-layer HD camera Rigid-Flex PCB Manufacturers

We stick to our enterprise spirit of "Quality, Performance, Innovation and Integrity". We purpose to create a lot more price for our prospects with our rich resources, innovative machinery, experienced workers and great products and services for 16-layer HD camera Rigid-Flex PCB,8-layer medical device Rigid-Flex PCB,medical devices Rigid-Flex PCB, You would not have any communication problem with us. We sincerely welcome prospects all around the planet to call us for business enterprise cooperation.
16-layer HD camera Rigid-Flex PCB, After years' creating and developing, with the advantages of trained qualified talents and rich marketing experience, outstanding achievements were gradually made. We get good reputation from the customers due to our good solutions quality and fine after-sale service. We sincerely wish to create a more prosperous and flourishing future together with all the friends home and abroad!

Hot Products

  • XCZU2CG-L1SBVA484I

    XCZU2CG-L1SBVA484I

    XCZU2CG-L1SBVA484I ​The device not only provides scalability for 64 bit processors, but also combines real-time control with software and hardware engines to support graphics, video, waveform, and packet processing. The XCZU2CG-L1SBVA484I (CG) device adopts dual core Cortex technology ™- A53 and dual core Cortex ™- A heterogeneous processing system composed of R5 real-time processing units. This device is the best choice for industrial motor control and sensor fusion
  • XC7A100T-1FGG676I

    XC7A100T-1FGG676I

    ​XC7A100T-1FGG676I is an FPGA chip produced by Xilinx, belonging to the Artix-7 series, with the following characteristics:
  • XCVU095-1FFVB2104I

    XCVU095-1FFVB2104I

    ​XCVU095-1FFVB2104I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Kintex UltraScale series. This chip adopts advanced 20nm process technology, providing maximum performance and integration, especially suitable for applications in high-performance computing, network communication, data centers, and AI fields. Here are some detailed introductions about XCVU095-1FFVB2104I
  • 10AX115R3F40I2LG

    10AX115R3F40I2LG

    The 10AX115R3F40I2LG is the highest performing mid-range 20 nanometer FPGA with 96 full duplex transceivers, supporting a chip to chip data rate of 17.4Gbps. In addition, the FPGA also provides a backplane data transfer rate of up to 12.5 Gbps and up to 1.15 million equivalent logic units.
  • MT40A2G8SA-062E:F

    MT40A2G8SA-062E:F

    MT40A2G8SA-062E:F can accelerate product launch time and provide high-quality DRAM module solutions, whose reliability has been rigorously tested.
  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB

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