16-layer 2step HDI PCB Manufacturers

Adhering towards the theory of "quality, support, efficiency and growth", we've attained trusts and praises from domestic and international client for 16-layer 2step HDI PCB,6-layer 2step HDI PCB,14-layer 4step HDI PCB, We are expecting to cooperate with you on the basis of mutual benefits and common development. We will never disappoint you.
16-layer 2step HDI PCB, Due to our dedication, our products are well known throughout the world and our export volume continuously grows every year. We will continue to strive for excellence by providing high quality products that will exceed the expectation of our customers.

Hot Products

  • FR406 Rigid Flex PCB

    FR406 Rigid Flex PCB

    The combination of Rigid-Flex boards is widely used, for example: high-end smart phones such as iPhone; high-end Bluetooth headsets (requires signal transmission distance); smart wearable devices; robots; drones; curved displays; high-end industrial control equipment; Can see its figure. The following is about 6 Layer FR406 Rigid Flex PCB related, I hope to help you better understand 6 Layer FR406 Rigid Flex PCB.
  • XC95144XL-10TQG100C

    XC95144XL-10TQG100C

    XC95144XL-10TQG100C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TPS51200DRCR

    TPS51200DRCR

    TPS51200DRCR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400AN-4FG400C

    XC3S400AN-4FG400C

    XC3S400AN-4FG400C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX066K3F40I2LG

    10AX066K3F40I2LG

    10AX066K3F40I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Thin Film Circuit Board

    Thin Film Circuit Board

    Thin film circuit board has good thermal and electrical properties, and is an excellent material for power LED packaging. Thin film circuit board is especially suitable for packaging structures such as multi-chip (MCM) and substrate directly bonded chip (COB); it can also be used as other high-power The heat dissipation circuit board of the power semiconductor module.

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