14-layer 4step HDI PCB Manufacturers

We depend on sturdy technical force and continually create sophisticated technologies to meet the demand of 14-layer 4step HDI PCB,6-layer 2step HDI PCB,16-layer 2step HDI PCB, Therefore, we could satisfy different inquiries from different clients. Remember to come across our web site to check additional facts from our items.
14-layer 4step HDI PCB, We provide good quality but unbeatable low price and the best service. Welcome to post your samples and color ring to us .We are going to produce the items according to your request. If you are interested in any items we offer, please feel free to contact us directly by mail, fax, telephone or internet. We've been here to answer your questions from Monday to Saturday and looking forward to cooperating with you.

Hot Products

  • IC Carrier Board

    IC Carrier Board

    The IC carrier board is mainly used to carry the IC, and there are lines inside to conduct the signal between the chip and the circuit board. In addition to the function of the carrier, the IC carrier board also has a protection circuit, a dedicated line, a heat dissipation path, and a component module. Standardization and other additional functions.
  • BCM54210SB0KMLG

    BCM54210SB0KMLG

    BCM54210SB0KMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5SGXMA3H2F35C2LN

    5SGXMA3H2F35C2LN

    ​5SGXMA3H2F35C2LN is an FPGA (Field Programmable Gate Array) product produced by Intel Corporation, belonging to the Stratix V GX series. This FPGA has 957 logic units (LABs) and 432 input/output (I/O) terminals, making it suitable for applications that require highly programmable logic solutions.
  • XC6SLX100T-2FGG676C

    XC6SLX100T-2FGG676C

    XC6SLX100T-2FGG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-3FIGD2104E

    XCVU13P-3FIGD2104E

    ​XCVU13P-3FIGD2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, with the following features and specifications: Number of logic elements: There are 3780000 logic elements (LE). Adaptive Logic Module (ALM): Provides 216000 ALMs. Embedded memory: Built in 94.5 Mbit of embedded memory. Number of input/output terminals: Equipped with 752 I/O terminals.
  • BCM89259YD0BFBGT

    BCM89259YD0BFBGT

    BCM89259YD0BFBGT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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