10M08DFV81I8G Manufacturers

We hold strengthening and perfecting our items and repair. At the same time, we get the job done actively to do research and progress for 10M08DFV81I8G, We are going to do our greatest to satisfy or exceed customers' prerequisites with excellent goods, advanced concept, and economical and timely company. We welcome all clients.
10M08DFV81I8G, We insist on "Quality First, Reputation First and Customer First". We are committed to providing high-quality items and good after-sales services. Up to now, our solutions have been exported to more than 60 countries and areas around the world, such as America, Australia and Europe. We enjoy a high reputation at home and abroad. Always persisting in the principle of "Credit, Customer and Quality", we expect cooperation with people in all walks of life for mutual benefits.

Hot Products

  • XC6VLX240T-2FFG1759C

    XC6VLX240T-2FFG1759C

    XC6VLX240T-2FFG1759C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM65235D0IFSBG

    BCM65235D0IFSBG

    BCM65235D0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TU-943R High-speed PCB

    TU-943R High-speed PCB

    TU-943R High-speed PCB - when wiring the multi-layer printed circuit board, as there are not many lines left in the signal line layer, adding more layers will cause waste, increase certain workload and increase the cost. To solve this contradiction, we can consider wiring on the electrical (ground) layer. First of all, the power layer should be considered, followed by the formation. Because it is better to preserve the integrity of the formation.
  • 10M08DAU324C8G

    10M08DAU324C8G

    ​10M08DAU324C8G is a high-performance FPGA (Field Programmable Gate Array) chip, belonging to the Intel MAX 10 series, with the following features and advantages:
  • 5CSXFC4C6U23I7N

    5CSXFC4C6U23I7N

    ​5CSXFC4C6U23I7N is an embedded system on chip (SoC) under Intel/Altera, belonging to the Cyclone V SX series. This product integrates the ARM Cortex-A9 MPCore processor, features dual cores, and comes with the CoreSight debugging system. Its RAM capacity is 64KB and it has rich peripheral interfaces
  • 12OZ Heavy copper PCB

    12OZ Heavy copper PCB

    12OZ Heavy copper PCB is a layer of copper foil bonded on the glass epoxy substrate of printed circuit board. When the copper thickness is ≥ 2oz, it is defined as Heavy copper PCB. Performance of Heavy copper PCB: 12OZ Heavy copper PCB has the best elongation performance, which is not limited by processing temperature. Oxygen blowing can be used at high melting point, and brittle at low temperature. It is also fireproof and belongs to non combustible material. Even in highly corrosive atmospheric environment, copper board will form a strong, non-toxic passivation protection layer.

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