10M08DFV81I7G Manufacturers

"Based on domestic market and expand abroad business" is our improvement strategy for 10M08DFV81I7G, Now we have established steady and long business relationships with customers from North America, Western Europe, Africa, South America, more than 60 countries and regions.
10M08DFV81I7G, We have been always creating new technology to streamline the production, and offer goods with competitive prices and high quality! Customer satisfaction is our priority! You can let us know your idea to develop unique design for your own model to prevent too much similar parts in the market! We'll offer you our best service to satisfy all your needs! Be sure to contact us right away!

Hot Products

  • EP4CE22E22C8N

    EP4CE22E22C8N

    EP4CE22E22C8N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CEBA7F23I7N

    5CEBA7F23I7N

    ​The 5CEBA7F23I7N is a Field-Programmable Gate Array (FPGA) device manufactured by Intel (formerly Altera Corporation). It belongs to the Cyclone V series, which is designed to accommodate shrinking power consumption, cost, and time-to-market requirements
  • 5CSEMA4U23I7N

    5CSEMA4U23I7N

    ​5CSEMA4U23I7N is a SoC FPGA chip produced by Altera (now part of Intel Programmable Solutions Group). The chip is packaged in UBGA-672 and features an ARM Cortex A9 core with a dual core design. It supports a maximum clock frequency of up to 925MHz and is equipped with abundant logic elements and memory resources
  • XCKU095-2FFVB1760E

    XCKU095-2FFVB1760E

    XCKU095-2FFVB1760E has the highest signal processing bandwidth among mid-range next-generation transceivers and can be used for packet processing in 100G networks and data center applications.
  • BCM89887A1AFBG

    BCM89887A1AFBG

    BCM89887A1AFBG is typically packaged in a BGA (Ball Grid Array) or similar high-density packaging format. The chip is available through authorized distributors and resellers worldwide. Lead times and pricing may vary depending on market conditions and supplier agreements.
  • XC6SLX45T-2CSG324I

    XC6SLX45T-2CSG324I

    XC6SLX45T-2CSG324I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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