10M04DAU324C8G Manufacturers

"Based on domestic market and expand abroad business" is our improvement strategy for 10M04DAU324C8G, Now we have established steady and long business relationships with customers from North America, Western Europe, Africa, South America, more than 60 countries and regions.
10M04DAU324C8G, Strong infrastructure is the require of any organization. We have been backed with a robust infrastructural facility that enables us to manufacture, store, quality check and dispatch our merchandise worldwide. To maintain smooth work flow, we have now sectioned our infrastructure into a number of departments. All these departments are functional with latest tools, modernized machines and equipment. Owing to which, we're able to accomplish voluminous production without compromising upon the quality.

Hot Products

  • XC7A75T-2FGG484C

    XC7A75T-2FGG484C

    XC7A75T-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX1140T-2FLG1928C

    XC7VX1140T-2FLG1928C

    XC7VX1140T-2FLG1928C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU115-2FLVA1517E

    XCKU115-2FLVA1517E

    ​XCKU115-2FLVA1517E is an FPGA chip produced by Xilinx, belonging to the Kintex UltraScale architecture, with high performance and low power consumption characteristics. This chip adopts second-generation 3D integrated circuit technology and has over 1.5 million system logic units and 624 input/output ports, which can be flexibly configured for various applications
  • EP2C50F672I8N

    EP2C50F672I8N

    EP2C50F672I8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EPM7128AETC100-10N

    EPM7128AETC100-10N

    EPM7128AETC100-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 18-Layer Rigid-Flex PCB

    18-Layer Rigid-Flex PCB

    18-Layer Rigid-Flex PCB refers to a printed circuit board containing one or more rigid areas and one or more flexible areas, which is composed of rigid boards and flexible boards orderly laminated together, and is electrically connected with metallized holes. Rigid Flex PCB not only can provide the support function that rigid pcb should have, but also has the bending property of flexible board, which can meet the requirements of 3D assembly.

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