10AX090H3F34I2SG Manufacturers

The very rich projects management experiences and one to one service model make the high importance of business communication and our easy understanding of your expectations for 10AX090H3F34I2SG, Our tenet is evident each of the time: to provide good quality solution at competitive rate to clients throughout the planet. We welcome potential purchasers to call us for OEM and ODM orders.
10AX090H3F34I2SG, Our company, is always regarding quality as company' s foundation, seeking for development via high degree of credibility , abiding by iso9000 quality management standard strictly , creating top-ranking company by spirit of progress-marking honesty and optimism.

Hot Products

  • XC7V585T-1FF1761I

    XC7V585T-1FF1761I

    XC7V585T-1FF1761I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • LTC5541IUH#TRPBF

    LTC5541IUH#TRPBF

    LTC5541IUH#TRPBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU29P-2FSGA2577E

    XCVU29P-2FSGA2577E

    XCVU29P-2FSGA2577E is an FPGA chip from Xilinx, with the following features and specifications: Brand and Manufacturer: Xilinx is the manufacturer of this chip, renowned in the industry for its high quality and reliability. ‌
  • 8 Layer Robot HDI PCB

    8 Layer Robot HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used. The following is about 8 Layer Robot HDI PCB related, I hope to help you better understand 8 Layer Robot HDI PCB.
  • XCKU095-2FFVC1517I

    XCKU095-2FFVC1517I

    XCKU095-2FFVC1517I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TPS79333DBVR

    TPS79333DBVR

    TPS79333DBVR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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