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10AX016E4F29E3SG Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • XC6SLX45-3FGG484C

    XC6SLX45-3FGG484C

    XC6SLX45-3FGG484C is a field-programmable gate array (FPGA) manufactured by Xilinx, a leading company in the development of advanced semiconductor technology. This particular device has a density of 45,408 logic cells, 2.1 Mb of distributed RAM,
  • XC7VX485T-2FFG1158C

    XC7VX485T-2FFG1158C

    XC7VX485T-2FFG1158C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-2FLGA2577I

    XCVU13P-2FLGA2577I

    XCVU13P-2FLGA2577I Minimum operating temperature -40C Maximum operating temperature +100℃ Installation mode SMD/SMT Package: FBGA-2577 Data rate 30.5 Gb/s Quantity: 156PCS Batch :2023+
  • Half-hole HDI PCB

    Half-hole HDI PCB

    Half-hole HDI PCB is a compact product designed for small capacity users. It adopts modular parallel design, with a module capacity of 1000VA (height of 1U), natural cooling, and can be directly put into a 19 "rack, with a maximum of 6 modules in parallel. The product adopts full digital signal processing (DSP) technology and a number of patent technologies. It has a full range of load adaptability and strong short-term overload capacity, and can not consider the load power factor and peak factor.
  • XC6SLX9-3CSG324C

    XC6SLX9-3CSG324C

    XC6SLX9-3CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB
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    The photovoltaic effect of semiconductor material is the basic principle of solar cell operation. At present, the photovoltaic application of semiconductor materials has become a hot topic and is currently the fastest growing and best developing clean energy market in the world. The main production material of solar cells is semiconductor materials,

  • Advantages of HDI PCB

    1. It can reduce the cost of HDI PCB: When the density of PCB increases to more than eight-layer board, it is manufactured with HDI, and its cost will be lower than that of the traditional complex pressing process.

  • Why should PCB be cleaned?

    When troubleshooting non-functional or poorly performing circuits, engineers can usually run simulations or other analysis tools to consider the circuit from the schematic level.

  • Development of printed circuit board substrate materials

    The development of printed circuit board substrate materials has gone through nearly 50 years

  • Dongbao Circuit Board Industrial Park to build a park with an annual output value of 10 billion yuan

    According to the relevant person in charge of the management committee of Dongbao Industrial Park, the park has officially entered 6 companies, including Meidian, Weide, and Jiuxiang have been put into production, Jinrun Dingsheng is debugging equipment, Hongxin Huayin, Yongchuangxin are under construction Plant.

  • Foxconn changes cage to Phoenix and wants to regain market with 8K

    Guo Taiming described its acquisition of Sharp and the introduction of 8K display technology as a replacement for the phoenix. Whether this phoenix can bring Guo Taiming the expected growth and prompt Foxconn to regain the market is still to be verified.

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