10AS048H3F34E2SG Manufacturers

With our abundant experience and considerate products and services, we have been recognized to be a reputable supplier for a lot of global consumers for 10AS048H3F34E2SG, We have been wanting forwards to creating long-term company interactions with around the world shoppers.
10AS048H3F34E2SG, Now we have a excellent team supplying specialist service, prompt reply, timely delivery, excellent quality and best price to our customers. Satisfaction and good credit to every customer is our priority. We have been sincerely looking forward to cooperate with customers all over the world. We believe we can satisfy with you. We also warmly welcome customers to visit our company and purchase our solutions.

Hot Products

  • copper paste plug hole PCB

    copper paste plug hole PCB

    18 layers copper paste plug hole PCB realizes high-density assembly of printed circuit boards and non-conductive copper paste for via plug holes of wiring. It is widely used in aviation satellites, servers, wiring machines, LED backlights, etc.The following is about 18 layers copper paste plug hole, I hope to help you better understand 18 layers copper paste plug hole.
  • XC7VX1140T-3FLG1928I

    XC7VX1140T-3FLG1928I

    XC7VX1140T-3FLG1928I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B is a type of DDR4 SDRAM module. It has a total capacity of 8GB and uses a 288-pin form factor. This module operates at a speed of 2400MHz and has a CAS latency of 17 clock cycles
  • 10AX115H3F34I2SG

    10AX115H3F34I2SG

    ​10AX115H3F34I2SG adopts a 20 nanometer process, which can provide high performance, supporting chip to chip data transmission rates of up to 17.4 Gbps, backplane data transmission rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.
  • XC6SLX25T-2CSG324I

    XC6SLX25T-2CSG324I

    XC6SLX25T-2CSG324I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • LTM4628EV#PBF

    LTM4628EV#PBF

    ​LTM4628EV#PBF also supports frequency synchronization, multi-phase operation, burst mode operation, and output voltage tracking functions for power rail sorting. It adopts a space saving design while having good heat resistance, and the pin coating complies with SnPb (BGA) or RoHS standards.

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