10G photoelectric PCB Manufacturers

We have state-of-the-art equipment. Our products are exported for the USA, the UK and so on, enjoying a fantastic status among the clients for 10G photoelectric PCB,IS420 PCB,25G photoelectric PCB,Hard gold PCB, If you're searching for a top quality, fast delivery, greatest following company and superior value supplier in China for long-term business partnership, we're going to be your best choice.
10G photoelectric PCB, We are eager to cooperate with foreign companies which care much on the real quality, stable supply, strong capability and good service. We can offer the most competitive price with high quality,because we are much MORE PROFESSIONAL. You are welcomed to visit our company at any time.

Hot Products

  • 10M04SAU169I7G

    10M04SAU169I7G

    ​10M04SAU169I7G is a single-chip, non-volatile, low-cost programmable logic device (PLD) used to integrate the best system components. The highlights of Intel 10M04SAU169I7G include dual configuration flash memory for internal storage, user flash memory, support for instant boot, integrated analog-to-digital converter (ADC), and support for single chip Nios II soft core processors. 10M04SAU169I7G is an ideal solution for system management, I/O expansion, communication control plane, industrial, automotive, and consumer electronics products.
  • LT3502AEDC#TRPBF

    LT3502AEDC#TRPBF

    LT3502AEDC#TRPBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XAZU5EV-1SFVC784Q

    XAZU5EV-1SFVC784Q

    ​XAZU5EV-1SFVC784Q is an FPGA chip launched by Xilinx, belonging to the XA Zynq UltraScale+MPSoC series. This chip integrates a feature rich 64 bit quad core Arm Cortex-A53 processor and dual core Arm Cortex-R5 processing system (PS), as well as the UltraScale architecture of Xilinx programmable logic (PL), all integrated into a single device. In addition, it also includes on-chip memory, multi port external memory interfaces, and a rich set of peripheral connection interfaces
  • ST115G PCB

    ST115G PCB

    ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.
  • BCM6715B0KFFBG

    BCM6715B0KFFBG

    BCM6715B0KFFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX150T-3FGG900C

    XC6SLX150T-3FGG900C

    XC6SLX150T-3FGG900C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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