100-layer double-sided Press backdrill board Manufacturers

The customer satisfaction is our primary goal. We uphold a consistent level of professionalism, quality, credibility and service for 100-layer double-sided Press backdrill board,Aluminum nitride ceramic PCB,Double-sided ceramic board,Buried resistor PCB, We welcome buyers all around the word to call us for long term company associations. Our items are the most effective. Once Selected, Ideal Forever!
100-layer double-sided Press backdrill board, So far our goods have been exported to east Europe, the Middle East, Southeast, Africa and South America etc. We have now 13years professional sales and purchase in Isuzu parts at home and abroad and the ownership of the modernized electronic Isuzu parts checking systems. We honor our core principal of Honesty in business, priority in service and will do our best to offer our customers with high quality goods and excellent service.

Hot Products

  • XCZU2CG-L1SBVA484I

    XCZU2CG-L1SBVA484I

    XCZU2CG-L1SBVA484I ​The device not only provides scalability for 64 bit processors, but also combines real-time control with software and hardware engines to support graphics, video, waveform, and packet processing. The XCZU2CG-L1SBVA484I (CG) device adopts dual core Cortex technology ™- A53 and dual core Cortex ™- A heterogeneous processing system composed of R5 real-time processing units. This device is the best choice for industrial motor control and sensor fusion
  • XC7A100T-1FGG676I

    XC7A100T-1FGG676I

    ​XC7A100T-1FGG676I is an FPGA chip produced by Xilinx, belonging to the Artix-7 series, with the following characteristics:
  • XCVU095-1FFVB2104I

    XCVU095-1FFVB2104I

    ​XCVU095-1FFVB2104I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Kintex UltraScale series. This chip adopts advanced 20nm process technology, providing maximum performance and integration, especially suitable for applications in high-performance computing, network communication, data centers, and AI fields. Here are some detailed introductions about XCVU095-1FFVB2104I
  • 10AX115R3F40I2LG

    10AX115R3F40I2LG

    The 10AX115R3F40I2LG is the highest performing mid-range 20 nanometer FPGA with 96 full duplex transceivers, supporting a chip to chip data rate of 17.4Gbps. In addition, the FPGA also provides a backplane data transfer rate of up to 12.5 Gbps and up to 1.15 million equivalent logic units.
  • MT40A2G8SA-062E:F

    MT40A2G8SA-062E:F

    MT40A2G8SA-062E:F can accelerate product launch time and provide high-quality DRAM module solutions, whose reliability has been rigorously tested.
  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB

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