With the continuous upgrading of electronic products and the gradual application of 5G products, the demand for Rigid-Flex PCB has increased. There is a big difference between designing Rigid-Flex PCB and simply designing Flex-PCB and Rigid-PCB.The following is a detailed description of some requirements for the design of conventionalRigid-Flex PCB.
With the emergence of new technologies such as the Internet of Things and cloud computing, a series of new changes have occurred in the manufacturing industry in 2016.
The main purpose of PCB factory automation and smart factory design investment is to save labor costs, improve product yield, reduce operation intensity and effectively arrange production in order to achieve effective coordination of various processes and optimal operation of the factory.
This article will review the development history of carbon series direct plating technology, including new breakthroughs in equipment technology, and how to apply it to today's flagship mobile phones with extremely fine line width and line spacing.
At present, the dividend ceiling of smart phones is gradually emerging, especially the competition in the Chinese market is particularly fierce. In January, Huawei's sales were 4.72 million units, a slight decrease of 0.4%, and sales were 10.89 billion yuan, a decrease of 1.5%.
In mid-March 2017, Intel officially released the new SSD DC P4800X based on Optane flash technology, which is targeted for data center applications. Alibaba and Tencent were first deployed.
