Reasons for blistering of multilayer circuit board
The covering film of FPC circuit board shall be processed by opening the window, but it cannot be processed immediately after being taken out from the cold storage. Especially when the ambient temperature is high and the temperature difference is large, water droplets will condense on the surface.
The difference between the excimer laser and the impact carbon dioxide laser through-hole of the flexible circuit board:
Before designing a multi-layer PCB circuit board, the designer needs to first determine the circuit board structure used according to the scale of the circuit, the size of the circuit board and the requirements of electromagnetic compatibility (EMC)
At present, there are two general FPC welding processes, one is tin press welding, and the other is manual drag welding
