Before designing multi-layer PCB circuit board, the designer needs to first determine the circuit board structure according to the scale of the circuit, the size of the circuit board and the requirements of electromagnetic compatibility (EMC),
of FPC is becoming more and more significant in order to achieve more functions. Now Jin Baize will talk about the characteristics of FPC on the advantages and disadvantages of FPC.
FPC soft board is an important electronic component. It is also the carrier of electronic components and the electrical connection of electronic components. Through the analysis of the development of FPC soft board in the main regions, the market development trend and the comparative analysis of domestic and foreign markets, this paper gives you a better understanding of FPC Industry.
At present, the coating method of resist is divided into the following three methods according to the precision and output of circuit graphics: screen missing printing method, dry film / photosensitive method and liquid resist photosensitive method.
Reasons for blistering of multilayer circuit board
The covering film of FPC circuit board shall be processed by opening the window, but it cannot be processed immediately after being taken out from the cold storage. Especially when the ambient temperature is high and the temperature difference is large, water droplets will condense on the surface.
