Products
Home > Products > RO4360G2 low loss high frequency PCB

RO4360G2 low loss high frequency PCB Manufacturers

No matter new customer or old customer, We believe in long term and trusted relationship for RO4360G2 low loss high frequency PCB,Ro4003CLoPro high frequency circuit board,RO3010 high frequency microwave PCB,Ro4003CLoPro PCB,Ro4003CLoPro high frequency PCB, Prospects first! Whatever you require, we should do our utmost to help you. We warmly welcome clients from all around the globe to cooperate with us for mutual enhancement.
RO4360G2 low loss high frequency PCB, With the effort to keep pace with world's trend, we'll always endeavor to meet customers' demands. If you want develop any other new items, we can customize them to suit your needs. If you feel interest in any of our products and solutions or want develop new merchandise, you should feel free to contact us. We are looking forward to forming successful business relationship with customers all over the world.

Related Products

Hot Products

  • XCZU25DR-1FFVG1517E

    XCZU25DR-1FFVG1517E

    XCZU25DR-1FFVG1517E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2AGX65DF29I3N

    EP2AGX65DF29I3N

    EP2AGX65DF29I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • HI-8591PSI

    HI-8591PSI

    HI-8591PSI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ADS1112IDRCR

    ADS1112IDRCR

    ADS1112IDRCR is a precision analog-to-digital converter (ADC) developed by Texas Instruments, a leading semiconductor technology company. This device features a 16-bit resolution, which provides high-precision conversion for analog signals. The device operates on a single power supply ranging from 2.0V to 5.5V and consumes very low power.
  • XC18V01PCG20C

    XC18V01PCG20C

    ​The production status of XC18V01PCG20C is in production, indicating that the product is still in production and sales. According to supplier information, the product is provided by multiple global suppliers, including AiPCBA (Hong Kong), Avnet (United States), Lichuang Mal
  • 5AGTFD7K3F40I3N

    5AGTFD7K3F40I3N

    5AGTFD7K3F40I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Related Blog
  • Reviews

  • Thermal stress treatment quality of heavy copper PCB

    When designing a circuit, factors such as thermal stress are very important, and engineers should eliminate thermal stress as much as possible. Over time, PCB manufacturing processes have continued to evolve, and various PCB technologies have been invented, such as aluminum PCBs, which can handle thermal stress. It is in the interests of heavy copper PCB designers to minimize the power budget while maintaining the circuit. Performance and environmentally friendly design with heat dissipation performance.

  • The growth rate of global chip market slowed down in the first quarter of 2022

    Our reporter Shen Cong reported: the American Semiconductor Industry Association (SIA) recently released the data of the global chip market in the first quarter of 2022. The data show that the growth rate of the global chip market has slowed down significantly

  • PCB production, you must pay attention to these matters

    Cutting, fillet, edging, baking, inner layer pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, target drilling, Gong edge, drilling, copper plating, film pressing, printing, writing, surface treatment, final inspection, packaging and other processes are countless

  • How to solve the problem of high-end PCB proofing

    As we all know, the competition in China's PCB manufacturing industry is very fierce. A complete industrial chain has been formed from a series of processes such as PCB proofing, mass production, packaging and transportation. In recent years, through extensive and rapid development and cruel market competition, the basic pattern of China's PCB industry has been formed. Relevant data show that by 2020, the number of PCB enterprises in Chinese Mainland alone will reach more than 2000, an amazing number.

  • How to maintain PCB in PCB Factory

    Although PCB board has a certain self-protection function, it should be avoided from being in a corrosive environment in daily use, and the corrosive factors should be eliminated as much as possible so as to greatly extend its service life. When using, try to keep it in a medium temperature environment to avoid high temperature and low temperature environment. So how does the PCB Factory maintain the PCB?

  • XCVU9P-L2FLGA2577E is a powerful and high-performance FPGA chip

    XCVU9P-L2FLGA2577E adopts the advanced Virtex UltraScale+architecture and is a member of this series of chips.

Send Inquiry