RO3010 high frequency microwave PCB Manufacturers

The incredibly rich projects administration experiences and a person to 1 service model make the substantial importance of organization communication and our easy understanding of your expectations for RO3010 high frequency microwave PCB,Ro4003CLoPro high frequency circuit board,RO4360G2 low loss high frequency PCB,Ro4003CLoPro PCB,Ro4003CLoPro high frequency PCB, We honor our core principal of Honesty in company, priority in service and will do our best to provide our buyers with high-quality products and solutions and great support.
RO3010 high frequency microwave PCB, We attained ISO9001 which provides solid foundation for our further development. Persisting in "High quality, Prompt Delivery, Competitive Price", now we have established long-term cooperation with clients from both overseas and domestically and get new and old clients' high comments. It is our great honor to meet your demands. We have been sincerely expecting your attention.

Hot Products

  • mmWave PCB

    mmWave PCB

    mmwave PCB-Wireless devices and the amount of data they process increase exponentially every year (53% CAGR). With the increasing amount of data generated and processed by these devices, the wireless communication mmwave PCB connecting these devices must continue to develop to meet the demand.
  • XC7Z020-1CLG400I

    XC7Z020-1CLG400I

    ​The XC7Z020-1CLG400I embedded system on chip (SoC) adopts a dual core ARM Cortex-A9 processor configuration, integrating 7 series programmable logic (up to 6.6M logic units and 12.5Gb/s transceiver), providing highly differentiated design for various embedded applications.
  • TG250 PCB

    TG250 PCB

    Tg250 PCB is made of polyimide material. It can withstand high temperature for a long time and does not deform at 230 degrees. It is suitable for high temperature equipment, and its price is slightly higher than that of ordinary FR4
  • XCS40XL-4PQG208C

    XCS40XL-4PQG208C

    XCS40XL-4PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • MT41K128M16JT-125AAT:K

    MT41K128M16JT-125AAT:K

    ​MT41K128M16JT-125AAT:K is a type of dynamic random-access memory (DRAM) module commonly used in computer systems. It has a capacity of 2 GB and a data transfer rate of 1600 megatransfers per second (MT/s).
  • XCVU27P-3FIGD2104I

    XCVU27P-3FIGD2104I

    XCVU27P-3FIGD2104I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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