AP9161R PCB Manufacturers

​XCVU29P-2FSGA2577I is an electronic component from Xilinx, specifically part of the UltraScale+FPGA (Field Programmable Gate Array) series. The following is a detailed introduction to XCVU29P-2FSGA2577I:

10AS048H3F34E2SG is an FPGA chip with excellent performance and broad application prospects. It features high performance, low power consumption, flexibility, and reliability, making it suitable for application scenarios that require these characteristics

XCVU9P-L2FLGA2104E is a Virtex UltraScale+ FPGA chip from Xilinx, a leading provider of programmable logic solutions. This chip is part of Xilinx's high-performance Virtex UltraScale+ series and features 4.5 million logic cells, 83,520 DSP slices, and 1,728 Mb of UltraRAM

XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.

XC2S200-5PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

LTC5541IUH#TRPBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.