8-layer m4 high-speed PCB Manufacturers

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Hot Products

  • XC2C384-10TQG144I

    XC2C384-10TQG144I

    XC2C384-10TQG144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TPS51200AQDRCTQ1

    TPS51200AQDRCTQ1

    TPS51200AQDRCTQ1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1000-4FTG256I

    XC3S1000-4FTG256I

    XC3S1000-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • CY15B104Q-LHXI

    CY15B104Q-LHXI

    CY15B104Q-LHXI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AP7164E PCB

    AP7164E PCB

    8-Layers AP7164E PCB is mainly used in various products such as mobile phones, digital cameras, tablets, notebook computers, wearable devices and so on. The application of FPC flexible circuit boards in smart phones accounts for a large proportion. Our company can skillfully produce multi-layer fpc, soft-hard combination fpc, multi-layer HDI soft-hard combination board. It has stable cooperation with HP, Dell, Sony, etc.
  • XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements

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