4layer high frequency PCB Manufacturers

Just about every member from our large efficiency income crew values customers' wants and enterprise communication for 4layer high frequency PCB,RT6010 PCB,RT6002 PCB,RT5880 PCB, The concept of our organization is "Sincerity, Speed, Provider, and Satisfaction". We are going to follow this concept and earn more and more customers' satisfaction.
4layer high frequency PCB, Relying on superior quality and excellent post-sales, our items sell well in America, Europe, the Middle East and South Africa. We're also the appointed OEM factory for several worlds' famous merchandise brands. Welcome to contact us for further negotiation and cooperation.

Hot Products

  • XC6SLX100T-3CSG484C

    XC6SLX100T-3CSG484C

    XC6SLX100T-3CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S500E-4FGG320C

    XC3S500E-4FGG320C

    XC3S500E-4FGG320C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • TU-768 PCB

    TU-768 PCB

    TU-768 PCB refers to high heat resistance.General Tg plates are above 130 ° C, high Tg is generally more than 170 ° C, and medium Tg is about more than 150 ° C. Generally, Tg≥170 ° C PCB printed board is called high Tg printed board.
  • S25FL256SAGNFI00

    S25FL256SAGNFI00

    S25FL256SAGNFI00 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU19EG-3FFVC1760E

    XCZU19EG-3FFVC1760E

    ​XCZU19EG-3FFVC1760E Zynq™ UltraScale+ ™ MPSoC devices have 64 bit processor scalability, combining real-time control with software and hardware engines, and are suitable for graphics, video, waveform, and packet processing applications
  • XC7V585T-1FF1761I

    XC7V585T-1FF1761I

    XC7V585T-1FF1761I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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