2-layer Alumina ceramic PCB Manufacturers

Quality comes first; service is foremost; business is cooperation" is our business philosophy which is constantly observed and pursued by our company for 2-layer Alumina ceramic PCB,Cermic PCB,3-layer Aluminum nitride ceramic PCB,AIN PCB,LED Aluminum Nitride Ceramic base board, Welcome your visiting and any your inquires,sincerely hope we can have chance to cooperate with you and we can build up long well business relationship with you.
2-layer Alumina ceramic PCB, To create more creative goods, maintain high-quality goods and update not only our merchandise but ourselves so as to keep us ahead of the world, and the last but most vital one: to make every client satisfied with everything we provide and to grow stronger together. To be the real winner, starts here!

Hot Products

  • 10AX048H3F34I2LG

    10AX048H3F34I2LG

    10AX048H3F34I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7VX690T-3FFG1761E

    XC7VX690T-3FFG1761E

    XC7VX690T-3FFG1761E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU43DR-2FSVE1156I

    XCZU43DR-2FSVE1156I

    XCZU43DR-2FSVE1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM7250ZBKFEBB3G

    BCM7250ZBKFEBB3G

    BCM7250ZBKFEBB3G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56880BOKFSBG

    BCM56880BOKFSBG

    BCM56880BOKFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX115H3F34I2SG

    10AX115H3F34I2SG

    ​10AX115H3F34I2SG adopts a 20 nanometer process, which can provide high performance, supporting chip to chip data transmission rates of up to 17.4 Gbps, backplane data transmission rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.

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