Products
Home > Products > 2-layer Alumina ceramic PCB

2-layer Alumina ceramic PCB Manufacturers

Quality comes first; service is foremost; business is cooperation" is our business philosophy which is constantly observed and pursued by our company for 2-layer Alumina ceramic PCB,Cermic PCB,3-layer Aluminum nitride ceramic PCB,AIN PCB,LED Aluminum Nitride Ceramic base board, Welcome your visiting and any your inquires,sincerely hope we can have chance to cooperate with you and we can build up long well business relationship with you.
2-layer Alumina ceramic PCB, To create more creative goods, maintain high-quality goods and update not only our merchandise but ourselves so as to keep us ahead of the world, and the last but most vital one: to make every client satisfied with everything we provide and to grow stronger together. To be the real winner, starts here!

Related Products

Hot Products

  • GH100-884K-A1

    GH100-884K-A1

    GH100-884K-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX066H3F34I2LG

    10AX066H3F34I2LG

    10AX066H3F34I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XA6SLX9-2FTG256Q

    XA6SLX9-2FTG256Q

    XA6SLX9-2FTG256Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM84074AIFSBLG

    BCM84074AIFSBLG

    BCM84074AIFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX75T-3CSG484I

    XC6SLX75T-3CSG484I

    XC6SLX75T-3CSG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K160T-2FFG676C

    XC7K160T-2FFG676C

    XC7K160T-2FFG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Microprocessor vs. Integrated Circuit in Electronics Design

    You’re likely to deal with integrated circuits in electronics design. Occasionally, you may face the herculean task of working with a microprocessor. It’s a mistake to assume that designing with a microprocessor is similar to typical ICs.

  • Difference between missing printing covering layer and laminated covering film of FPC circuit board

    After the covering film of FPC circuit board is positioned, it is necessary to heat and pressurize to make the adhesive completely solidified and integrated with the circuit.

  • Design steps of multilayer circuit board

  • PCB modular layout ideas

    Faced with the increasingly high integration of hardware platforms and more and more complex electronic systems, the PCB layout should have a modular thinking, which requires the use of modularity in the design of hardware schematics and PCB wiring. , Structured design method. As a hardware engineer, on the premise of understanding the overall architecture of the system, first of all, we should consciously merge modular design ideas in the schematic diagram and PCB wiring design, combined with the actual situation of the PCB, plan the basic idea of PCB layout.

  • The characteristics of rigid-flex board

    Rigid-flex board is a combination of flexible board and hard board. It is a circuit board formed by combining a thin layered flexible bottom layer with a rigid bottom layer, and then laminating it into a single component.The flexible board is used to replace the cable assembly to complete the highly reliable connection and transmission of power and electrical signals.The product can work stably and reliably for a long time under harsh environments such as high and low temperature, high humidity, vibration, salt spray, and low air pressure. At present, Jonhon Optronic has provided rigid and flexible printed board solutions for aviation, aerospace, ships, weapons and other fields.

  • Huawei Yu Chengdong: P10 sales to break 10 million to catch up with Apple

    At present, the dividend ceiling of smart phones is gradually emerging, especially the competition in the Chinese market is particularly fierce. In January, Huawei's sales were 4.72 million units, a slight decrease of 0.4%, and sales were 10.89 billion yuan, a decrease of 1.5%.

Send Inquiry