It is generally believed that if the frequency of a digital logic circuit reaches or exceeds 45MHZ ~ 50MHZ, and the circuit operating above this frequency has already occupied a certain portion of the entire electronic system (say 1/3), it is called a high-speed circuit. The following is about R5775G High-speed PCB related, I hope to help you better understand R5775G High-speed PCB.
The delay per unit inch on the PCB is 0.167ns. However, if there are more vias, more device pins, and more constraints set on the network cable, the delay will increase. Generally, the signal rise time of high-speed logic devices is about 0.2ns. If there are GaAs chips on the board, the maximum wiring length is 7.62mm. The following is about RO3003 PCB related, I hope to help you better understand RO3003 PCB.
Signal transmission occurs at the moment when the signal state changes, such as rise or fall time. The signal passes a fixed time from the driving end to the receiving end. If the transmission time is less than 1/2 of the rise or fall time, the reflected signal from the receiving end will reach the driving end before the signal changes state. Conversely, the reflected signal will reach the drive end after the signal changes state. If the reflected signal is strong, the superimposed waveform may change the logic state. The following is about 12 Layer Taconic High Frequency Board related, I hope to help you better understand 12-Layer Taconic High Frequency PCB.
The harmonic frequency of the signal edge is higher than the frequency of the signal itself, which is the unintended result of the signal transmission caused by the rapidly changing rising and falling edges (or signal jumps) of the signal. Therefore, it is generally agreed that if the line propagation delay is greater than the rise time of the 1/2 digital signal drive terminal, such signals are considered to be high-speed signals and produce transmission line effects. The following is about Ro4003CLoPro PCB related, I hope to help you better understand Ro4003CLoPro PCB.
The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
AP8525R Rigid-Flex PCB: refers to a special circuit board made by laminating a rigid circuit board (PCB) and a flexible circuit board (FPC). The board materials used are mainly rigid sheet FR4 and flexible sheet polyimide (PI). The following is about AP8525R Rigid Flex Board related, I hope to help you better understand AP8525R Rigid Flex Board.
