TU-943N High-speed PCB -- the development of electronic technology is changing with each passing day. This change mainly comes from the progress of chip technology. With the wide application of deep submicron technology, semiconductor technology is becoming increasingly physical limit. VLSI has become the mainstream of chip design and application.
TU-1300E High-speed PCB -- expedition unified design environment combines FPGA design and PCB design completely, and automatically generates schematic symbols and geometric packaging in PCB design from FPGA design results, which greatly improves the design efficiency of designers.
TU-933 High-speed PCB--with the rapid development of electronic technology, more and more large-scale integrated circuits (LSI) are used. At the same time, the use of deep submicron technology in IC design makes the integration scale of the chip larger.
TU-768 PCB refers to high heat resistance.General Tg plates are above 130 ° C, high Tg is generally more than 170 ° C, and medium Tg is about more than 150 ° C. Generally, Tg≥170 ° C PCB printed board is called high Tg printed board.
EM-370 HDI PCB--From the perspective of major manufacturers, the existing capacity of domestic major manufacturers is less than 2% of the global total demand. Although some manufacturers have invested in expanding production, the capacity growth of domestic HDI still can not meet the demand of rapid growth.
EM-526 High-speed PCB, with the rapid development of electronic technology, more and more large-scale integrated circuits (LSI) are used. At the same time, the use of deep submicron technology in IC design makes the integration scale of the chip larger.
