AP8545R Rigid-Flex PCB refers to the combination of soft board and hard board. It is a circuit board formed by combining the thin flexible bottom layer with the rigid bottom layer, and then laminating into a single component. It has the characteristics of bending and folding. Due to the mixed use of various materials and multiple manufacturing steps, the processing time of rigid Flex PCB is longer and the production cost is higher.
In the PCB proofing of electronic consumer, the use of R-F775 PCB not only maximizes the space use and minimizes the weight, but also greatly improves the reliability, thus eliminating many requirements for welded joints and fragile wiring prone to connection problems. The rigid Flex PCB also has high impact resistance and can survive in high stress environment.
18-Layer Rigid-Flex PCB refers to a printed circuit board containing one or more rigid areas and one or more flexible areas, which is composed of rigid boards and flexible boards orderly laminated together, and is electrically connected with metallized holes. Rigid Flex PCB not only can provide the support function that rigid pcb should have, but also has the bending property of flexible board, which can meet the requirements of 3D assembly.
Electronic design is constantly improving the performance of the whole machine, but also trying to reduce its size. From mobile phones to smart weapons, "small" is the eternal pursuit. High density integration (HDI) technology can make terminal product design more miniaturized, while meeting higher standards of electronic performance and efficiency. Welcome to buy 6-Layer HDI PCB from us.
ELIC HDI PCB printed circuit board is the use of the latest technology to increase the use of printed circuit boards in the same or smaller area. This has driven major advances in mobile phone and computer products, producing revolutionary new products. This includes touch-screen computers and 4G communications and military applications, such as avionics and intelligent military equipment.
Half-hole HDI PCB is a compact product designed for small capacity users. It adopts modular parallel design, with a module capacity of 1000VA (height of 1U), natural cooling, and can be directly put into a 19 "rack, with a maximum of 6 modules in parallel. The product adopts full digital signal processing (DSP) technology and a number of patent technologies. It has a full range of load adaptability and strong short-term overload capacity, and can not consider the load power factor and peak factor.
