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TU-943R High-speed PCB - when wiring the multi-layer printed circuit board, as there are not many lines left in the signal line layer, adding more layers will cause waste, increase certain workload and increase the cost. To solve this contradiction, we can consider wiring on the electrical (ground) layer. First of all, the power layer should be considered, followed by the formation. Because it is better to preserve the integrity of the formation.
TU-752 High-speed PCB digital circuit has high frequency and strong sensitivity of analog circuit. For signal line, high frequency signal line should be far away from sensitive analog circuit device as far as possible. For ground wire, the whole PCB has only one node to the outside world. Therefore, it is necessary to deal with the problem of common ground of digital and analog in PCB, while in the board, digital ground and analog ground are actually separated, and they are not mutually related Connection is only at the interface between PCB and the outside world (such as plug, etc.). There is a little short circuit between digital ground and analog ground, please note that there is only one connection point. Some of them are not grounded on the PCB, which is decided by the system design.
As TU-768 Rigid-Flex PCB design is widely used in many industrial fields, in order to ensure a high first-time success rate, it is very important to learn the terms, requirements, processes and best practices of rigid flex design. TU-768 Rigid-Flex PCB can be seen from the name that rigid flex combination circuit is composed of rigid board and flexible board technology. This design is to connect the multilayer FPC to one or more rigid boards internally and / or externally.
The main function of 40G optical module PCB is to realize photoelectric and electro-optic transformation, including optical power control, modulation and transmission, signal detection, IV conversion and limiting amplification judgment regeneration. In addition, there are anti-counterfeiting information query, TX disable and other functions. The common functions are: SFF, SFF, GBP +, GBIC, XFP, 1x9, etc.
EM-888 HDI PCB is the abbreviation of high density interconnection. It is a kind of printed circuit board (PCB) production. It is a circuit board with high line distribution density using micro blind buried hole technology. EM-888 HDI PCB is a compact product designed for small capacity users.
