The XC6SLX45-3CSG324I platform devices support up to 150K logic density, 4.8Mb memory, integrated storage controllers, and easy-to-use high-performance system IPs (such as DSP modules), while adopting innovative open standard based configurations.
XC6VLX365T-2FFG1759I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order. Our company has professional supply chain services at multiple levels, including forecasting, contracts, stocking, in transit, inventory, and credit, to help customers shorten product procurement cycles, reduce inventory, lower costs, and improve market response speed,
XC6VSX475T-2FF1156E Package BGA Integrated Circuit Chip IC Electronic Component Inquiry and Order
XC6SLX150T-N3FGG676I is a high-performance FPGA chip with a wide range of applications, including communication, data centers, image processing, and radar systems. This chip has high performance and flexibility, and can achieve high-speed signal processing
XC6SLX150-3FGG676I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order placement
XC6SLX16-3CSG225C Packaging BGA integrated circuit chips, IC electronic components, inquiry and order placement
