The via-in-PAD is an important part of the multilayer PCB. It not only bears the performance of the main functions of the PCB, but also uses the via-in-PAD to save space.The following is about VIA in PAD PCB related, I hope to help you better understand VIA in PAD PCB.
Buried vias: Buried vias only connect the traces between the inner layers, so they are not visible from the PCB surface. Such as 8layer board, the holes of 2-7 layers are buried holes.The following is about Mechanical Blind Buried Hole PCB related, I hope to help you better understand Mechanical Blind Buried Hole PCB.
The high frequency mixed board is a circuit board made by mixing high frequency materials with common FR4 materials. This structure is cheaper than pure high frequency materials.The following is about High frequency with Mixture PCB related, I hope to help you better understand High frequency with Mixture PCB.
Thick copper board are mainly high-current substrates. High-current substrates are generally high-power or high-voltage substrates, which are mostly used in automotive electronics, communications equipment, aerospace, planar transformers, and secondary power modules.The following is about New energy car 6OZ Heavy copper PCB related, I hope to help you better understand New energy car 6OZ Heavy copper PCB.
SFP optical module products are the latest optical modules, and are also the most widely used optical module products. The SFP optical module inherits the hot-swappable characteristics of GBIC and also draws on the advantages of SFF miniaturization.The following is about 1.25G Optical Module PCB related, I hope to help you better understand 1.25G Optical Module PCB.
It has a number of leading technologies in the industry, including: the first uses a 0.13 micron manufacturing process, has 1GHz speed DDRII memory, perfectly supports Direct X9, and so on.The following is about High speed Graphics Card PCB related, I hope to help you better understand High speed Graphics Card PCB.
