The hard and soft combination board has both the characteristics of FPC and PCB, so it can be used in some products with special requirements, which have both a certain flexible area and a certain rigid area, which saves the internal space of the product and reduces Finished product volume and improve product performance are of great help.The following is about Camera Rigid Flex PCB related, I hope to help you better understand Camera Rigid Flex PCB.
The AP8515R Rigid-Flex PCB has both the characteristics of FPC and PCB, so it can be used in some products with special requirements, which have both a certain flexible area and a certain rigid area, which saves the internal space of the product and reduces Finished product volume and improve product performance are of great help.The following is about 12R8F Rigid-Flex PCB related, I hope to help you better understand AP8515R Rigid-Flex PCB.
Gold finger PCB In the extensive use of PCI cable socket gold fingers, gold fingers have been divided into: long and short gold fingers, broken gold fingers, split gold fingers, and gold finger boards. In the process of processing, gold-plated wires need to be pulled. Comparison of conventional gold finger processing processes Simple, long and short gold fingers, the need to strictly control the lead of the gold fingers, requires a second etching to complete.The following is about Gold finger Board related, I hope to help you better understand Gold finger Board.
Traditionally, for reliability reasons, passive components have tended to be used on the backplane. However, in order to maintain the fixed cost of the active board, more and more active devices such as BGA are designed on the backplane.The following is about Red High speed Backplane. related, I hope to help you better understand Red High speed Backplane.
Optical modules are optoelectronic devices that perform photoelectric and electro-optical conversion. The transmitting end of the optical module converts the electrical signal into an optical signal, and the receiving end converts the optical signal into an electrical signal. The optical modules are classified according to the packaging form. Common ones include SFP, SFP +, SFF, and Gigabit Ethernet interface converter (GBIC).The following is about 100G Optical Module PCB related, I hope to help you better understand 100G Optical Module PCB.
20-layer PCB--The increase in the density of integrated circuit packaging has led to a high concentration of interconnect lines, which makes the use of multiple substrates a necessity. In the layout of the printed circuit, unforeseen design problems have appeared, such as noise, stray capacitance, and crosstalk. The following is about 20 layer Pentium Motherboard related, I hope to help you better understand 20-layer PCB.
