FPGA PCB(field programmable gate array) is a product of further development based on pal, gal and other programmable devices. As a kind of semi custom circuit in the field of application specific integrated circuit (ASIC), it not only solves the shortcomings of custom circuit, but also overcomes the shortcomings of limited gate circuits of original programmable devices.
EM-891K HDI PCB is made of EM-891k material with the lowest loss of EMC brand by HONTEC. This material has the advantages of high speed, low loss and better performance.
ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
Ladder PCB technology can reduce the thickness of PCB locally, so that the assembled devices can be embedded in the thinning area, and realize the bottom welding of ladder, so as to achieve the purpose of overall thinning.
800G optical module PCB - at present, the transmission rate of global optical network is rapidly moving from 100g to 200g / 400g. In 2019, ZTE, China Mobile and Huawei respectively verified in Guangdong Unicom that single carrier 600g can achieve 48tbit / s transmission capacity of single fiber.
mmwave PCB-Wireless devices and the amount of data they process increase exponentially every year (53% CAGR). With the increasing amount of data generated and processed by these devices, the wireless communication mmwave PCB connecting these devices must continue to develop to meet the demand.
