integrated circuit

An integrated circuit is a miniature electronic device or component. A certain process is used to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, fabricate on a small or several small semiconductor wafers or dielectric substrates, and then package them in a package , It becomes a micro structure with the required circuit function
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  • ​XCKU3P-2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) chip launched by Xilinx. This chip belongs to the UltraScale architecture and has excellent cost-effectiveness, performance, and power consumption performance, making it particularly suitable for applications such as packet processing,

  • ​XCKU035-1FFVA1156C is an FPGA chip launched by Xilinx and belongs to the Kintex UltraScale series. This chip adopts a 16 nanometer process and is packaged in FCBGA with 318150 logic units and 1156 pins, making it widely used in high-performance computing and communication applications

  • ​XAZU5EV-1SFVC784Q is an FPGA chip launched by Xilinx, belonging to the XA Zynq UltraScale+MPSoC series. This chip integrates a feature rich 64 bit quad core Arm Cortex-A53 processor and dual core Arm Cortex-R5 processing system (PS), as well as the UltraScale architecture of Xilinx programmable logic (PL), all integrated into a single device. In addition, it also includes on-chip memory, multi port external memory interfaces, and a rich set of peripheral connection interfaces

  • ​XCVU13P-3FIGD2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, with the following features and specifications: Number of logic elements: There are 3780000 logic elements (LE). Adaptive Logic Module (ALM): Provides 216000 ALMs. Embedded memory: Built in 94.5 Mbit of embedded memory. Number of input/output terminals: Equipped with 752 I/O terminals.

  • ​XCVU080-1FFVA2104I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx. This chip belongs to the Virtex UltraScale series and provides maximum performance and integration, making it particularly suitable for applications that require high performance and large-scale integration. The XCVU080-1FFVA2104I chip adopts a 20nm process node,

  • ​XCAU10P-1FFVB676E is an Artix produced by AMD ® The UltraScale+series FPGA (Field Programmable Gate Array) chips are packaged in BGA-676 format. This chip features high performance, low power consumption, and high customizability, making it suitable for various high-performance application scenarios. The specific parameters of XCAU10P-1FFVB676E include:

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