integrated circuit

An integrated circuit is a miniature electronic device or component. A certain process is used to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, fabricate on a small or several small semiconductor wafers or dielectric substrates, and then package them in a package , It becomes a micro structure with the required circuit function
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  • ​XCKU025-1FFVA1156I is an ideal choice for packet processing and DSP intensive functions, suitable for various applications ranging from wireless MIMO technology to Nx100G networks and data centers.

  • ​XCKU15P-3FFVE1517E Kintex® UltraScale+ ™ FPGA provides high cost-effectiveness in FinFET nodes, offering an economical and efficient solution for applications that require high-end functionality, including 33Gb/s transceivers and 100G connectivity cores.

  • ​The XCKU025-2FFVA1156E has a power option that achieves the best balance between required system performance and low power envelope. Kintex UltraScale+devices are an ideal choice for packet processing and DSP intensive functions, as well as various applications ranging from wireless MIMO technology to Nx100G networks and data centers.

  • ​10AX115H3F34I2SG adopts a 20 nanometer process, which can provide high performance, supporting chip to chip data transmission rates of up to 17.4 Gbps, backplane data transmission rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.

  • ​10AX115U2F45I2SG 0AX115U2F45I2SG is a high-performance FPGA that uses a 20 nm process. The Arria ® 10 GX FPGA supports chip to chip data transfer rates of up to 17.4 Gbps, backplane data transfer rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.

  • ​XCVU190-2FLGB2104I Virtex ® UltraScale FPGAs: High capacity, high-performance FPGAs implemented using single-chip and next-generation SSI technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance by integrating various system level functionalities to meet critical market and application requirements.

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