XCZU47DR-L2FFVG1517I Xilinx XC7A100T-2FGG676I Can achieve higher cost-effectiveness in multiple aspects, including logic, signal processing, embedded memory, LVDS I/O, memory interfaces, and transceivers. Artix-7 FPGAs are perfect for cost sensitive applications that require high-end functionality.
The XCZU15EG-2FFVB1156I chip is equipped with 26.2 Mbit embedded memory and 352 input/output terminals. 24 DSP transceiver, capable of stable operation at 2400MT/s. There are also 4 10G SFP+fiber optic interfaces, 4 40G QSFP fiber optic interfaces, 1 USB 3.0 interface, 1 Gigabit network interface, and 1 DP interface. The board has a self-control power on sequence and supports multiple startup mode
As a member of the FPGA chip, XCVU9P-2FLGA2104I has 2304 programmable logic units (PLs) and 150MB of internal memory, providing a clock frequency of up to 1.5 GHz. Provided 416 input/output pins and 36.1 Mbit distributed RAM. It supports field programmable gate array (FPGA) technology and can achieve flexible design for various applications
XCKU060-2FFVA1517I has been optimized for system performance and integration under the 20nm process, and adopts single chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
The XCVU065-2FFVC1517I device provides optimal performance and integration at 20nm, including serial I/O bandwidth and logic capacity. As the only high-end FPGA in the 20nm process node industry, this series is suitable for applications ranging from 400G networks to large-scale ASIC prototype design/simulation.
The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.
