HONTEC is one of leading Ceramic PCB manufacture, who specializes in high-mix,low volume and quickturn prototype PCB for high-tech industries in 28 countries.
Our Ceramic PCB has passed UL, SGS and ISO9001 certification, we are in application of ISO14001 and TS16949 as well.
Located in Shenzhen of GuangDong, HONTEC partners up with UPS, DHL and world-class forwarders to provide efficient shipping services. Welcome to buy Ceramic PCB from us. Every request from customers is being replied within 24 hours.
Thin film circuit board has good thermal and electrical properties, and is an excellent material for power LED packaging. Thin film circuit board is especially suitable for packaging structures such as multi-chip (MCM) and substrate directly bonded chip (COB); it can also be used as other high-power The heat dissipation circuit board of the power semiconductor module.
Ceramic PCB substrate is a 96% aluminum oxide ceramic double-sided copper clad substrate, which is mainly used in high-power module power supplies, high-power LED lighting substrates, solar photovoltaic substrates, high-power microwave power devices, which have high thermal conductivity, high pressure resistance, high temperature resistance, solderability resistance.
AIN PCB have excellent properties such as high thermal conductivity, high strength, high resistivity, small density, low dielectric constant, non-toxicity, and thermal expansion coefficient matching with Si. AIN PCB will gradually replace traditional high-power LED base material and become A ceramic substrate material with the most future development. The most suitable heat dissipation substrate for AIN PCB
Multilayer Ceramic PCB substrate refers to a special process board where copper foil is directly bonded to the surface (single side or double side) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The following is about Multilayer Ceramic Circuit Board related, I hope to help you better understand Multilayer Ceramic Circuit Board PCB.
